DE400 电子束蒸发真空镀膜系统镀膜机_-德仪科技有限公司手机版

详细介绍

The DE400 Electron Beam Evaporator is assembled with one e-beam source, the substrate is mounting on the horizontal axial on the side of chamber for the substrate polar to change the deposition angle.

DE400电子束蒸发仪配置一个电子束蒸发源，基片架装于腔体侧面水平转动的轴上，基片可以改变镀膜角度

Configuration

主要配置

Evaporation Chamber

蒸发腔体

304 stainless steel chamber with viewport

蒸发腔体为304不锈钢，并有观察窗

Vacuum Pumping

真空泵

Cryo-pump or Turbo pump and dry rough pump

蒸发室配备分子泵和无油机械泵

Vacuum Valve

真空阀门

Pneumatic UHV gate valves

气动控制超高真空插板阀

Evaporation Source

蒸发源

Multi pocket e-beam source

多坩埚电子束蒸发源

Substrate Chamber

样品室

304 stainless steel chamber with viewport

蒸发腔体为304不锈钢，并有观察窗

Sample Stage

样品台

Side mount polar Substrate

侧面安装的转角样品台

Film Control

膜厚检测

Crystal Film thickness Monitor and Control

晶振膜厚监控

Vacuum Gauging

真空测量

Wide range vacuum gauge and rough gauge

宽量程真空计用于测量真空和粗抽计

Specification

主要技术指标

The Base Vacuum Pressure

极限真空度

better than 9E-9 Torr

优于9E-9托

Sample Loading Capacity

装样能力

One Max. 4 inch flat substrate

一个zui大4英寸的平板基片

Rate Resolution

蒸发速率分辨率

0.05 Angstroms/sec

Thickness Resolution = 0.02 Angstroms

膜厚分辨率

0.02 Angstroms

Features

特点

Unique Design of Substrate Chamber and Sources chamber isolated by UHV gate valve

*的结构设计，基片腔体和蒸发源腔体通过UHV门阀隔开

All Metal Seal, True UHV System

系统采用全金属密封，真正的超高真空系统

Stand along system frameworks and electric rack

独立的系统机架和电器柜

E-beam source Water Interlock

电子束蒸发源冷水安全互锁

Optional Substrate Cooling

样品台可选水冷

Typical Application

典型应用

For R&D Thin Film Deposition

用于薄膜沉积研发

Ideal tools for LIFT-OFF process

用于LIFT-OFF工艺的理想平台

Ideal tools for GLAD process

用于GLAD工艺的理想平台

Evaporate metal, Semiconductor or Insulation Materials （material depends）

可蒸发金属，半导体或介质材料（视具体材料而定）

Evaporate Magnetic Materials

可蒸发磁性材料

LOAD LOCK

预真空进样室（可选）

产品简介

详细介绍

Typical Application

典型应用