DE400D DE400D 热阻蒸发薄膜沉积系统
产品简介
the top of the chamber and rotary or on the horizontal axial on the side of chamber
详细信息
Configuration
主要配置
| Evaporation Chamber 蒸发腔体 | 304 stainless steel chamber with viewport 蒸发腔体为304不锈钢，并有观察窗 |
| Vacuum Pumping 真空泵 | Cryo-pump or Turbo pump and dry rough pump 配备冷凝泵或分子泵和无油机械泵 |
| Vacuum Valve 真空阀门 | Pneumatic HV gate valves 气动控制高真空插板阀 |
| Evaporation Source 蒸发源 | Multiple thermal evaporation source 多组热蒸发源 |
| Optional Load Lock chamber 样品室 | 304 stainless steel chamber with viewport 蒸发腔体为304不锈钢，并有观察窗 |
| Sample Stage 样品台 | Top mount and rotary or Side mount polar Substrate 顶部安装旋转的样品台或侧面安装的转角样品台 |
| Film Control 膜厚检测 | Crystal Film thickness Monitor and Control 晶振膜厚监控 |
| Vacuum Gauging 真空测量 | Wide range vacuum gauge and rough gauge 宽量程真空计用于测量真空和粗抽计 |
Specification
主要技术指标
| The Base Vacuum Pressure 极限真空度 | Better than 5E-8 Torr 优于5E-8托 |
| Sample Loading Capacity 装样能力 | One Max. 8 inch flat substrate or multi small substrate 一个zui大8英寸的平板基片或多个小基片 |
| Max. Evaporation Temperature zui高蒸发温度 |
1500oC |
| Rate Resolution 蒸发速率分辨率 | 0.05 Angstroms/sec |
| Thickness Resolution = 0.02 Angstroms 膜厚分辨率 | 0.02 Angstroms
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Features 特点
D shape Chamber of front open door for easy inside operation D型腔体前开门便于腔体内部操作和维护
Stand along system frameworks and electric rack 独立的系统机架和电器柜
The deposition process can be accuray controlled by source temperature or film thickness control 薄膜沉积工艺可以通过准确的温度控制，也可通过膜厚仪准确控制速率
Optional Substrate Cooling or heating 样品台可选水冷或加热
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Typical Application
典型应用
For R&D Thin Film Deposition
用于薄膜沉积研发
Ideal tools for LIFT-OFF process
用于LIFT-OFF工艺的理想平台
Ideal tools for GLAD process with side mount substrate stage
若采用侧装样品台可用成为GLAD工艺的理想平台
Evaporate metal, Semiconductor or Insulation Materials （material depends）
可蒸发金属，半导体或介质材料（视具体材料而定）