With the application of Bi-axial stretching Technology, this brand polyimide film, the low thermal expansion coefficient polyimide film, is made from polyamic acid resins, which is obtained from a novel formula comprised of new anhydride monomers as well as a mine monomers. It not only processes good performance of ordinary polyimide film but also has better dimension stability, higher modulus of elasticity and lower heat expansion coefficient.
1. Technical Requirement 1.1 Thickness and Width
Thickness
12.5
25.0
Tolerance
+1/-1
+1/-2
Width
≤520
≤520
Notes: Thickness is supplied as the requests of customer
1.2 Performace Index
No.
Index
Unit
Index Value
12.5μm
25.0μm
1
Tensile
CD / MD
MPa
≥200
2
Elongation
CD / MD
%
≥40
3
Tensile modulus
CD / MD
GPa
≥4.0
4
Heat expansion coefficient CD/MD 200℃, 2h
%
≤0.1
5
Electrical operating frequency intensity
Average
MV/m
≥200
6
Heat expansion coefficient 25-200℃
ppm / ℃
15-25
5
A wet sexual * RH
%
≤2.5
6
Volume resistivity 200℃
Ω ·cm
≥1.0X1012
7
Relative dielectric constant 48-62Hz
--
3.0-3.5
8
Dielectric loss factor 48-62Hz
--
≤0.002
2. Application 6052E low expansion coefficient polyimide film processes higher dimension stability. Its CTE is very near copper foil which is ideal material for FPC as copper board cover.
